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Power, Cooling Shape the Future of AI Infra: ABI Research

Summary by RCR Wireless News
Novel cooling and power technologies help manage heat from high-density compute In sum – what you need to know: Power and cooling now core to AI infra – High-density GPU workloads are pushing legacy data centers to the brink, making advanced cooling like liquid immersion and heat reuse standard practice by 2026. Power, not chips, […]
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The Next Platform broke the news in on Thursday, May 15, 2025.
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